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  • Industry-Leading Thermal and Visible Camera Performance

    Collect high-speed, VGA radiometric thermal and HD visible imagery.

  • Built for Integrators

    Reduce development cost and time to market with solution from a single, reliable supplier.

  • Size, Weight, and Power (SWaP) Optimized Design

    Optimize design and operation time with compact, lightweight, and low-power module.

Teal 2 sUAS Overview feat. Hadron 640R

Traffic Surveillance with Hadron 640R

Getting Started with NVIDIA Jetson Nano & FLIR Hadron 640R

Getting Started with Qualcomm RB5 and FLIR Hadron 640R


Integrating Teledyne FLIR thermal camera modules is now easier with our library of how-to-videos, application notes, and our comprehensive support center with product drawings, datasheets, and more!

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Thermal by FLIR is a cooperative product development and marketing program that supports original equipment manufacturers (OEMs) and product innovators who use FLIR thermal imaging sensors in their products. With Thermal by FLIR, let us help you create the next market-changing innovation to grow your business.

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The end-to-end computational imaging ecosystem that supports various AI-powered object detection and tracking capabilities and advanced image processing.

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With industry-leading reliability, performance, size, weight, and power, they are ideal for defense, commercial, and security applications.

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Camera Model Selector

Sorting through more than 100+ models can be tricky. Try our "Camera Model Selector" to find the right solution.

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Thermal Imaging Detector
Boson+ 640x512 pixels, 12mm pitch, USB 3.0, 2-lane MIPI, Radiometric
Temperature Accuracy
±5 °C less, over 0 °C to 100 °C range
Temperature Accuracy
±5 °C less, over 0 °C to 100 °C range
Imaging & Optical
EO Camera Optics
Kontatsu B0623D01-0, EFL 4.8mm, 67° HFOV, F/# 1/2.3
EO Camera Sensor
9248 x 6944 pixels (64.2 MP), 0.7 µm pitch, 4-lane MIPI
EO Camera Video
Full resolution @ 60 Hz
ICM20602, I2C or SPI (selectable)
IR Camera Optics
EFL 13.6mm, 32° HFOV, F/# 1.0
IR Camera Video
Full resolution @ 60Hz
Thermal Imaging Detector
Boson+ 640x512 pixels, 12mm pitch, USB 3.0, 2-lane MIPI, Radiometric
Thermal Sensitivity
<20 mK
Connections & Communications
Software Drivers
for NVIDIA Jetson Nano
for Qualcomm Snapdragon RB5
for Qualcomm Snapdrago 865
Electrical Interface
Hadron connector: Hirose DF40C-50DP-0.4V(51)
Example of mating connector: DF40HC(2.5)-50DS-0.4V(51)
5V supply voltage. Typical power dissipation < 1800mW, Max < 2900mW
Mechanical Interface
Screw mount to back plate
Size (w/o lens)
35 x 49 x 45 mm
Environmental & Approvals
Environmental Sealing
IP54 (with the rear interfaces sealed)
Operational & Storage Temperature
-20°C to +60°C
Tested EMI Performance
FCC part 15 Class B
Media gallery
Getting Started with NVIDIA Jetson Nano
Getting Started with Qualcomm RB5
XPONENTIAL 2023 feat. Hadron 640R Dev Kits for NVIDIA and Qualcomm
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Related Documents
Export Restrictions

Export Restrictions

The information contained in this page pertains to products that may be subject to the International Traffic in Arms Regulations (ITAR) (22 C.F.R. Sections 120-130) or the Export Administration Regulations (EAR) (15 C.F.R. Sections 730-774) depending upon specifications for the final product; jurisdiction and classification will be provided upon request.

Hadron™ 640 Series - Model: Hadron 640R+ (Radiometric)

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